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| With the PPI234 CM, IMASYS offers a flexible automatic handler for Smart Card Chip Modules on 35mm tape. This cost-effective platform is suitable for testing, counting and execution of multifarious encoding tasks of IC modules such as initialization, pre personalization, OS flashing or JAVA applet loading as an example. |
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| One of many applications is Smart Card OS life cycle management: |
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| 1. What is a secure Smartcard chip and where are those being used? |
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| It‘s an micro controller providing either a : |
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ISO/IEC 7816 conform contact interface or |
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ISO/IEC 14443 A/B conform contactless interface (HF, 13.56 MHz)
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Or a combination of both
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| Contains a CPU, RAM, EEROM, ROM as well as cryptographic coprocessors (DES/AES, PKC) and security sensors |
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| The new generation of controllers may include Flash memory |
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| It has an operating system (OS) |
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| Applications |
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ePassports and EID cards |
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Electronic driving licences |
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Health and other ID cards |
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High-security access control cards |
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Digital signature and other secure micro controller applications |
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| 2. What are the Smartcard life cycles and how to switch from one stage to the next? |
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Life cycles describes the series of stages, a Smart Card passes during its lifetime
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Switching from one state to the next stage typically is an one-way street and it‘s not possible to go backwards
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The processes to switch the life cycles are:
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| 1. Birth → 2. OS Ready = |
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Processes during wafer manufacturing (classic design) |
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OS Flash loading |
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| 2. OS Ready → 3. Initialized = Initialization (or Java Applet Loading) |
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3. Initialized → 4. Personalized = Personalization |
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| After Personalization, the OS switches to 5. Normal Operation, where it stays until Death |
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| Some OS implement an additional state Death, in which can be switched from any stage via an specific KILL command. |
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| Death stage ultimately can be reached by physically destroying the chip. |
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3. Example eID card: Typical Smartcard life cycle management process |
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4. Example eID card: Streamlined Smartcard life cycle management process |
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| Classic design vs. OS Flash loading |
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Specific Wafer mask for each Smartcard controller platform, OS and OS version → unflexible & high cost
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Often project specific Smartcard controller and OS combination → Made to order & high lead time
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Complex product management and vast number of different product codes |
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Time consuming development |
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OS loading decoupled from Wafer manufacturing process → Drastically increased flexibility |
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OS Flash loading can be done on module, inlay or even card level → Keeping stock probably is economical → Reduced lead time |
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Simplification of product and order management processes |
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Reduced time to market |
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