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| Wire Embedding for processing Contactless Inductive Coupling Flip Chip Module |
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| IMASYS’core team were the initial developers of the famous embedding technology in 1994. Over 20 years later, the embedding patent has been expired; however the IMASYS team made further developments to improve the quality of high speed embedding. Our latest development will enhance the performance of the embedded Booster Antennas for utilizing the Contactless Inductive Coupling Flip Chip Module. |
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| IMASYS is providing the latest State of the Art Technology in making transponder inlays with the Contactless Inductive Coupling Flip Chip Module Technology: |
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Enormous cost reduction through simplification of processes. |
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No physical bonding of the Chip Module to the Antenna. |
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Contactless Inductive Coupling Flip Chip Modules guarantee a very thin inlays on any thermoplastic material. |
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Homogeneously Monobloc Material Structure. |
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Very robust inlay. |
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High quality, stable and fast embedding process, developed for booster antenna embedding applications. |
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| The entire IP is protected by patents |
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